求人の要約 給与 年収 800 〜 2,000万円 職種 製品開発エンジニア 勤務地 神奈川 求人詳細 1. Packaging design for high power semiconductor laser devices... and above. 2. Deep understanding of GaAs-based and GaN-based semiconductor lasers and related packaging process. 3. Familiar...
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices...
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